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    TSMC production capacity 結果共5筆

  • TSMC rules out relocation amid Taiwan Strait tensions

    Discover how TSMC’s Chairman, C.C. Wei, addresses the impossibility of relocating operations amid geopolitical tensions and how NVIDIA’s CEO, Jensen Huang, values Taiwan’s manufacturing prowess.
    2024/06/06 15:21
  • TSMC to build third chip fab in Arizona, US

    TSMC announces plans for a third chip fab in Arizona while maintaining Taiwan as its primary production hub, with 80-90% of capacity remaining in Taiwan. TSMC’s advanced semiconductor technology is distributed across Hsinchu, Taichung, and Tainan, with new 2nm factories in Baoshan and Kaohsiung. TSMC is also planning a 1nm site in Chiayi or Yunlin, pending government assistance.
    2024/04/09 11:26
  • Goldman Sachs forecasts massive expansion for TSMC

    Goldman Sachs predicts that Taiwan Semiconductor Manufacturing Company (TSMC) will double its CoWoS production capacity by 2025, leading to a raised target price of NT$975. The forecast includes plans for advanced CoWoS packaging plants in Chiayi and potential expansion to Japan. Customer demand for advanced packaging, especially CoWoS, is expected to rise with the adoption of 2-nanometer process technology. Goldman Sachs also revised TSMC’s capital expenditure forecast and profit outlook for major AI companies, reflecting a positive growth trend in the industry.
    2024/03/25 12:49
  • TSMC’s new Japan Plant ignites local economy and nightlife

    The opening of TSMC’s new plant in Kikuyo, Japan, has revitalized the local economy and nightlife, with customers spending up to 1 million yen daily. The community’s transformation has garnered international attention, boosting sales in various industries and reshaping Kumamoto’s nightlife. TSMC’s significant investment in the project is expected to increase production capacity and potentially lead to the establishment of additional factories in the area.
    2024/02/17 14:33
  • TSMC expands in Japan with 2nd wafer plant slated for 2027

    Taiwan Semiconductor Manufacturing Company (TSMC) has announced that its Japan subsidiary, JASM, will construct a second wafer fabrication plant by the end of 2024. The plant is expected to be operational by the end of 2027. With support from the Japanese government, TSMC plans to begin production at its first JASM wafer fabrication plant in 2024, with a total investment exceeding US$20 billion. The construction of the second plant is driven by increasing customer demand. The expansion aims to optimize JASM’s cost structure and supply chain efficiency, resulting in increased production. Once both plants are operational, JASM’s Kumamoto wafer fabrication plant will have a monthly capacity of over 100,000 12-inch wafers. The Japan fab will offer process technologies ranging from 40nm to 6nm, catering to automotive, industrial, consumer, and high-performance computing applications. TSMC also mentioned that capacity planning can be adjusted based on client requirements. The Kumamoto wafer plant is expected to create more than 3,400 high-tech professional jobs.
    2024/02/07 14:37
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